Call For Papers

  • The International Conference on Communications and Electronics (ICCE) is becoming a reputable bi-annual international conference series in the scientific community on the areas of Electronics and Communications recently. Following the past successful ICCE 2016, which received over 250 submissions from 30 countries with the acceptance rate of 32%, the seventh IEEE ICCE (ICCE 2018) looks for significant contributions to various topics in communications engineering, networking, microwave engineering, signal processing, and electronic engineering. The conference will also include tutorials, workshops, and technology panels given by world-class speakers.


    All authors should prepare full version of papers with maximum length of 6 pages and submit via EDAS: Full accepted papers will be published in the IEEE ICCE 2018 Conference Proceedings and submitted for inclusion in IEEE Xplore®. The proceedings of ICCE series is regularly indexed by SCOPUS and listed in Conference Proceeding Citation Index (CPCI) of Thomson Reuters.


    Contributed papers are solicited describing original works in electronics, communication engineering and related technologies. Topics and technical areas of interest include but are not limited to the following:


    • Networking: Future Internet/Future Networks, SDN/NFV, Crowdsourcing, QoS/QoE and Resource Management, Green Networking, Optical Networks; Wireless, Mobile, Ad-hoc and Sensor Networks, Ubiquitous Networks and Internet of Things; Network Security; Cognitive Networks
    • Communication Systems: Coding and Information Theory; UWB; Ultrasonic, Under-Water Communications, Satellite Communications/GNSS; Radio-over-Fiber, Free Space and Fiber-Optic Communications; Software Defined Radio, Cognitive Radio; Cooperative Communications, Secured Communication Systems, Multi-Antenna Communication Systems; 5G Systems, Energy-Harvesting, Millimeter-Wave Communications, Device-to-Device Communications,  Green Communications


    • Microwave, Millimeter-Wave Devices/ Components Design and Techniques: Passive, Active Devices/Components, MEMS, Integration Techniques, Nano-Scale Devices, Millimeter-Wave and THz Components
    • Antenna and Propagation: Wideband, Multiband Antennas, Smart Antennas, Digital Beam Forming, MIMO, Massive MIMO, Antenna Modeling and Measurements,   Phased Arrays, Channel Modeling and Propagation
    • EM Field Theory and Simulation Techniques:  EM Field Theory, Numerical Techniques, Metamaterials, FSSs, Electromagnetic Bandgap Structures
    • RF, Microwave and Millimeterwave Systems and Applications: Radar, Remote sensing, Sensors and sensor system, Wireless power transmission
    • Other Related Technologies: Nanoscale Integration of Planar, Free-Space, and Mixed Subsystems, 3D Printed RF, RFID


    • Image, Video Processing, Analysis and Applications
    • 3D Image Processing and Scene Analysis, Multiview Data Integration, 3D Scene or Model Reconstruction from Time-of-Flight Cameras.
    • 3D Computer Vision Systems and Applications
    • Image Based Human-Computer Interaction
    • Biomedical Signal Processing and Analysis, Computer-Aided Diagnosis
    • Biomedical Applications in Molecular, Structural, and Function Imaging
    • PACS and Imaging Informatics
    • Ambient Intelligence
    • Audio, Acoustic Signal, Speech and Language Processing
    • Signal Filtering, Detection and Estimation
    • Statistical Signal Processing and Modeling
    • Signal Processing in Communications


    • Electronic Circuits: Analog, Digital, Mixed Signal
    • EDA: System Design, Synthesis and Optimization; Formal Methods and Verification
    • Architectures and Systems: NoC, Multi-Core, Video and Multimedia, Embedded Systems, Reconfigurable Computing, System-Level Power Management, IoT Devices, Hardware Security, High Performance/Parallel Computing Platforms for Big Data
    • Application Systems: Communication, Consumer and Multimedia; Medical and Healthcare; Spacecraft Avionics

    V. SPECIAL SESSIONS: ICCE 2018 offers special sessions, which provide an overview of the state-of-the-art and current research directions on communications and electronics. Please visit for more details.

  • Keynote Speakers


    Yasuhiko Arakawa
    University of Tokyo

  • Moshe Zukerman
    City University of Hong Kong

  • Jan Van der Spiegel
    University of Pennsylvania

  • Conference Official Address

    School of Electronics and Telecommunications
    Hanoi University of Science and Technology

    Address: C9-405, 1 Dai Co Viet Road, Hanoi, Vietnam
    Tel: 84-24-38692242
    Fax: 84-24-38692241